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  absolute maximum ratings stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. exposure to absolute- maximum-rated conditions for extended periods may affect device reliability. the thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. ambient temperature (t a ) is 25c, unless otherwise specified. description specifically designed for automotive applications, this hexfet ? power mosfet utilizes the latest processing techniques toachieve extremely low on-resistance per silicon area. additional features of this design are a 175c junction operating temperature, fast switching speed and improved repetitive avalanche rating . these features combine to make this design an extremely efficient and reliable device for use in automotive applications and a wide variety of other applications. features  advanced process technology  ultra low on-resistance  dynamic dv/dt rating  175c operating temperature  fast switching  repetitive avalanche allowed up to tjmax  lead-free, rohs compliant  automotive qualified * hexfet ? is a registered trademark of international rectifier. * qualification standards can be found at http://www.irf.com/ gds gate drain source   
        hexfet   power mosfet s d g v dss 150v r ds(on) typ. 10.0m max . 11.8m i d 105a symbol parameter units i d @ t c = 25c continuous drain current, v gs @ 10v i d @ t c = 100c continuous drain current, v gs @ 10v a i dm pulsed drain current p d @t c = 25c maximum power dissipation w linear derating factor w/c v gs gate-to-source voltage v e as single pulse avalanche energy (thermally limited)  mj i ar avalanche current a e ar repetitive avalanche energy mj dv/dt peak diode recovery  v/ns t j operating junction and c t stg storage temperature range soldering temperature, for 10 seconds (1.6mm from case) mounting torque, 6-32 or m3 screw thermal resistance symbol parameter typ. max. units r jc junction-to-case  CCC 0.40 c/w r ja junction-to-ambient (pcb mount)  CCC 40 max. 105 74 420380 -55 to + 175 20 2.5 230 see fig. 14, 15, 22a, 22b 32 10lbf  in (1.1n  m) 300 
  
 






 





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 s d g    repetitive rating; pulse width limited by max. junction temperature.   limited by t jmax , starting t j = 25c, l = 0.115mh r g = 25 ? , i as = 63a, v gs =10v. part not recommended for use above this value.  i sd 63a, di/dt 2510a/s, v dd v (br)dss , t j 175c.   pulse width 400s; duty cycle 2%.   c oss eff. (tr) is a fixed capacitance that gives the same charging time as c oss while v ds is rising from 0 to 80% v dss .  c oss eff. (er) is a fixed capacitance that gives the same energy as c oss while v ds is rising from 0 to 80% v dss .  when mounted on 1" square pcb (fr-4 or g-10 material). for recom mended footprint and soldering techniques refer to application note #an-994.   r is measured at t j approximately 90c. static electrical characteristics @ t j = 25c (unless otherwise specified) symbol parameter min. typ. max. units v (br)dss drain-to-source breakdown volta g e 150 CCC CCC v ? v (br)dss / ? t j breakdown volta g e temp. coefficient CCC 0.18 CCC v/c r ds(on) static drain-to-source on-resistance CCC 10. 11.8 m ? v gs(th) gate threshold volta g e 3.0 CCC 5.0 v g fs forward transconductance 93 CCC CCC s r g(int) internal gate resistance CCC 2.1 CCC ? i dss drain-to-source leaka g e current CCC CCC 20 a CCC CCC 250 i gss gate-to-source forward leaka g e CCC CCC 100 na gate-to-source reverse leaka g e CCC CCC -100 dynamic electrical characteristics @ t j = 25c (unless otherwise specified) symbol parameter min. typ. max. units q g total gate char g e CCC 73 110 nc q gs gate-to-source char g e CCC 28 CCC q gd gate-to-drain ("miller") char g e CCC 28 CCC q sync total gate char g e sync. (q g - q gd ) CCC 45 CCC t d(on) turn-on delay time CCC 18 CCC ns t r rise time CCC 50 CCC t d(off) turn-off delay time CCC 37 CCC t f fall time CCC 23 CCC c iss input capacitance CCC 5320 CCC c oss output capacitance CCC 490 CCC c rss reverse transfer capacitance CCC 110 CCC pf c oss eff. (er) effective output capacitance (energy related) CCC 450 CCC c oss eff. (tr) effective output capacitance (time related) CCC 520 CCC diode characteristics symbol parameter min. typ. max. units i s continuous source current CCC CCC 104 a (body diode) i sm pulsed source current CCC CCC 420 (body diode)  v sd diode forward volta g e CCC CCC 1.3 v t rr reverse recovery time CCC 82 CCC ns t j = 25c v r = 130v CCC 99 CCC t j = 125c i f = 63a q rr reverse recovery char g e CCC 271 CCC nc t j = 25c di / dt = 100a / s  CCC 385 CCC t j = 125c i rrm reverse recovery current CCC 6.0 CCC a t j = 25c t on forward turn-on time intrinsic turn-on time is ne g li g ible (turn-on is dominated by ls+ld) v gs = 20v v gs = -20v v ds = v gs , i d = 250a v ds = 150v, v gs = 0v v ds = 150v, v gs = 0v, t j = 125c mosfet symbol v ds = 75v conditions v gs = 10v  v gs = 0v v ds = 50v ? = 1.0mhz conditions v gs = 0v, i d = 250a reference to 25c, i d = 3.5ma v gs = 10v, i d = 63a  v ds = 50v, i d = 62a t j = 25c, i s = 63a, v gs = 0v  integral reverse p-n junction diode. showing the v gs = 0v, v ds = 0v to 120v  v gs = 0v, v ds = 0v to 120v  conditions i d = 63a i d = 63a r g = 2.1 ? v gs = 10v  v dd = 98v i d = 63a, v ds =0v, v gs = 10v downloaded from: http:///
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 # qualification information ? d 2 pak 7 pin msl1 class h2 (+/- 4000v) ?? aec-q101-001 charged device model class c5 (+/- 2000v) ?? aec-q101-005 esd machine model class m3 (+/- 400v) ?? aec-q101-002 rohs compliant yes qualification level automotive (per aec-q101) comments: this part number(s) passed automotive qualification. irs industrial and consumer qualification level is granted by extension of the higher automotive level. moisture sensitivity level human body model $
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  fig 1. typical output characteristics fig 3. typical transfer characteristics fig 4. normalized on-resistance vs. temperature fig 2. typical output characteristics fig 6. typical gate charge vs. gate-to-source voltage fig 5. typical capacitance vs. drain-to-source voltage 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) 0.01 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) vgs top 15v 10v 8.0v 7.0v 6.5v 6.0v 5.5v bottom 5.0v 60s pulse width tj = 25c 5.0v 0.1 1 10 100 1000 v ds , drain-to-source voltage (v) 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) vgs top 15v 10v 8.0v 7.0v 6.5v 6.0v 5.5v bottom 5.0v 60s pulse width tj = 175c 5.0v 3.0 4.0 5.0 6.0 7.0 8.0 9.0 v gs , gate-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( ) v ds = 50v 60s pulse width t j = 25c t j = 175c 1 10 100 v ds , drain-to-source voltage (v) 0 2000 4000 6000 8000 c , c a p a c i t a n c e ( p f ) v gs = 0v, f = 1 mhz c iss = c gs + c gd , c ds shorted c rss = c gd c oss = c ds + c gd c oss c rss c iss -60 -40 -20 0 20 40 60 80 100 120 140 160 180 t j , junction temperature (c) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 r d s ( o n ) , d r a i n - t o - s o u r c e o n r e s i s t a n c e ( n o r m a l i z e d ) i d = 63a v gs = 10v 0 2 04 06 08 01 0 0 q g total gate charge (nc) 0 4 8 12 16 v g s , g a t e - t o - s o u r c e v o l t a g e ( v ) v ds = 120v v ds = 75v v ds = 30v i d = 63a downloaded from: http:///
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 - fig 8. maximum safe operating area fig 10. drain-to-source breakdown voltage fig 7. typical source-drain diode forward voltage fig 11. typical c oss stored energy fig 9. maximum drain current vs. case temperature fig 12. maximum avalanche energy vs. draincurrent 0.0 0.5 1.0 1.5 2.0 v sd , source-to-drain voltage (v) 0.1 1 10 100 1000 i s d , r e v e r s e d r a i n c u r r e n t ( a ) t j = 25c t j = 175c v gs = 0v 25 50 75 100 125 150 175 t c , casetemperature (c) 0 20 40 60 80 100 120 i d , d r a i n c u r r e n t ( a ) -60 -40 -20 0 20 40 60 80 100 120 140 160 180 t j , temperature ( c ) 140 150 160 170 180 190 v ( b r ) d s s , d r a i n - t o - s o u r c e b r e a k d o w n v o l t a g e ( v ) id = 3.5ma 0 20 40 60 80 100 120 140 v ds, drain-to-source voltage (v) 0 1 2 3 4 e n e r g y ( j ) 0.1 1 10 100 1000 v ds , drain-tosource voltage (v) 0.1 1 10 100 1000 10000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) tc = 25c tj = 175c single pulse 1msec 10msec operation in this area limited by r ds (on) 100sec dc 25 50 75 100 125 150 175 starting t j , junction temperature (c) 0 200 400 600 800 1000 e a s , s i n g l e p u l s e a v a l a n c h e e n e r g y ( m j ) i d top 14a 24a bottom 63a downloaded from: http:///
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 . fig 13. maximum effective transient thermal impedance, junction-to-case fig 14. typical avalanche current vs.pulsewidth fig 15. maximum avalanche energy vs. temperature notes on repetitive avalanche curves , figures 14, 15:(for further info, see an-1005 at www.irf.com) 1. avalanche failures assumption: purely a thermal phenomenon and failure occurs at a temperature far inexcess of t jmax . this is validated for every part type. 2. safe operation in avalanche is allowed as long ast jmax is not exceeded. 3. equation below based on circuit and waveforms shown in figures 22a, 22b.4. p d (ave) = average power dissipation per single avalanche pulse. 5. bv = rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. i av = allowable avalanche current. 7. ? t = allowable rise in junction temperature, not to exceed t jmax (assumed as 25c in figure 14, 15).t av = average time in avalanche. d = duty cycle in avalanche = t av f z thjc (d, t av ) = transient thermal resistance, see figures 13) p d (ave) = 1/2 ( 1.3bvi av ) =   t/ z thjc i av = 2  t/ [1.3bvz th ] e as (ar) = p d (ave) t av 1e-006 1e-005 0.0001 0.001 0.01 0.1 t 1 , rectangular pulse duration (sec) 0.001 0.01 0.1 1 t h e r m a l r e s p o n s e ( z t h j c ) 0.20 0.10 d = 0.50 0.02 0.01 0.05 single pulse ( thermal response ) notes: 1. duty factor d = t1/t2 2. peak tj = p dm x zthjc + tc 1.0e-06 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 tav (sec) 0.1 1 10 100 1000 a v a l a n c h e c u r r e n t ( a ) 0.05 duty cycle = single pulse 0.10 allowed avalanche current vs avalanche pulsewidth, tav, assuming ? j = 25c and tstart = 150c. 0.01 allowed avalanche current vs avalanche pulsewidth, tav, assuming ? tj = 150c and tstart =25c (single pulse) 25 50 75 100 125 150 175 starting t j , junction temperature (c) 0 40 80 120 160 200 240 e a r , a v a l a n c h e e n e r g y ( m j ) top single pulse bottom 1% duty cycle i d = 63a ri (c/w) ? (sec) 0.015402 0.00001 0.056989 0.000065 0.180208 0.001377 0.146323 0.010705 j j 1 1 2 2 3 3 r 1 r 1 r 2 r 2 r 3 r 3 ci i / ri ci= i / ri c 4 4 r 4 r 4 downloaded from: http:///
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 3 fig 23a. switching time test circuit fig 23b. switching time waveforms fig 22b. unclamped inductive waveforms fig 22a. unclamped inductive test circuit t p v (br)dss i as r g i as 0.01 ? t p d.u.t l v ds + - v dd driver a 15v 20v v gs fig 24a. gate charge test circuit fig 24b. gate charge waveform vds vgs id vgs(th) qgs1 qgs2 qgd qgodr fig 21. 4

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 ! d 2 pak - 7 pin package outline dimensions are shown in millimeters (inches)  
          
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  d 2 pak - 7 pin part marking information d 2 pak - 7 pin tape and reel 6
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  ordering information base part number package type standard pack complete part number form quantity AUIRFS4115-7P d2pak 7 pin tube 50 AUIRFS4115-7P tape and reel left 800 auirfs4115-7trl downloaded from: http:///
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unless specifically designated for the automotive market, international rectifier corporation and its subsidiaries (ir) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or services without notice. part numbers designated with the au prefix follow automotive industry and / or customer specific requirements with regards to product discontinuance and process change notification. all products are sold subject to irs terms and conditions of sale supplied at the time of order acknowledgment. ir warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with irs standard warranty. testing and other quality control techniques are used to the extent ir deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ir assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ir components. to minimize the risks with customer products and applications, customers should provide adequate design and operating safeguards. reproduction of ir information in ir data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alterations is an unfair and deceptive business practice. ir is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ir products or serviced with statements different from or beyond the parameters stated by ir for that product or service voids all express and any implied warranties for the associated ir product or service and is an unfair and deceptive business practice. ir is not responsible or liable for any such statements. ir products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of the ir product could create a situation where personal injury or death may occur. should buyer purchase or use ir products for any such unintended or unauthorized application, buyer shall indemnify and hold international rectifier and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ir was negligent regarding the design or manufacture of the product. only products certified as military grade by the defense logistics agency (dla) of the us department of defense, are designed and manufactured to meet dla military specifications required by certain military, aerospace or other applications. buyers acknowledge and agree that any use of ir products not certified by dla as military-grade, in applications requiring military grade products, is solely at the buyers own risk and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ir products are neither designed nor intended for use in automotive applications or environments unless the specific ir products are designated by ir as compliant with iso/ts 16949 requirements and bear a part number including the designation au. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ir will not be responsible for any failure to meet such requirements. for technical support, please contact irs technical assistance center http://www.irf.com/technical-info/ world headquarters: 101 n. sepulveda blvd., el segundo, california 90245 tel: (310) 252-7105 downloaded from: http:///


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